发明名称 SOLID-STATE IMAGING DEVICE AND METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a solid-state imaging device capable of reducing a signal charge remaining in a photoelectric conversion element without being transferred to a floating diffusion, and to provide a method of manufacturing a solid-state imaging device.SOLUTION: According to one embodiment of the present invention, the solid-state imaging device is provided. The solid-state imaging device includes a first conductivity type semiconductor region and a second conductivity type semiconductor region. The first conductivity type semiconductor region is provided for each pixel of a captured image. The second conductivity type semiconductor region forms a PN junction with the first conductivity type semiconductor region to constitute a photoelectric conversion element. In the second conductivity type semiconductor region, the concentration of a second conductivity type impurity decreases from the center of the photoelectric conversion element toward a transfer gate for signal charge transfer.
申请公布号 JP2015035449(A) 申请公布日期 2015.02.19
申请号 JP20130164362 申请日期 2013.08.07
申请人 TOSHIBA CORP 发明人 MAEDA MOTOHIRO;TANAKA NAGATAKA
分类号 H01L27/146;H01L31/10 主分类号 H01L27/146
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