HEATING ELEMENT AND CIRCUIT MODULE STACK STRUCTURE

摘要

A heating element and circuit module stack structure includes a circuit module carrying a chip unit, a heat sink having a flat bottom block protruded from a thermally conductive base member and in contact with the chip unit, a heat transfer layer set between the thermally conductive base member and the chip unit around the flat bottom block, an electric heating element mounted in between the heat transfer layer and the thermally conductive base member around the flat bottom block for heating the chip unit, and a thermal insulation component isolating the thermally conductive base member from the electric heating element. The circuit module turns on the electrical heating element when the temperature of the chip unit drops blow 0° C., and turns off the electrical heating element when the temperature reaches the normal operating temperature range, enabling the computer to be used in a low temperature or cold outdoor environment.

主权项

1. A heating element and circuit module stack structure, comprising:
a circuit module comprising a circuit board and a chip unit mounted at said circuit board; a heat sink comprising a thermally conductive base member, said thermally conductive base member a flat bottom block protruded from a center area of a bottom wall thereof and kept in close contact with said chip unit of said circuit module; a heat transfer layer mounted in between said bottom wall of said thermally conductive base member of said heat sink and said chip unit of said circuit module around said flat bottom block; an electric heating element mounted in between said heat transfer layer and said bottom wall of said thermally conductive base member of said heat sink around said flat bottom block and adapted to heat said chip unit of said circuit module; and a thermal insulation component mounted in between said electric heating element and said bottom wall of said thermally conductive base member of said heat sink around said flat bottom block.