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发明名称
DOUBLE MOLD PACKAGE AND ITS MOLDING METHOD
摘要
申请公布号
KR100206982(B1)
申请公布日期
1999.07.01
申请号
KR19970002462
申请日期
1997.01.28
申请人
HYUNDAI MICRO ELECTRONICS CO.,LTD.
发明人
JANG, SE-JIN
分类号
H01L23/00;(IPC1-7):H01L23/00
主分类号
H01L23/00
代理机构
代理人
主权项
地址
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