| 摘要 |
<p>The present invention discloses a package-on-package structure and relates to the field of electronic component packaging technologies, so as to resolve a problem that universality of a top package is limited because top and bottom packages must be collaboratively designed. The package-on-package structure includes a top package and a bottom package from top to bottom, where the bottom package includes a first substrate and a second substrate from top to bottom; a pad is placed on one surface of the first substrate, where the pad is electrically connected to the top package; a chip is placed on the other surface of the first substrate; the second substrate is placed opposite to and below the chip; a first metal terminal is placed at a position that is between the first substrate and the second substrate and bypasses the chip; the first substrate is electrically connected to one surface of the second substrate by using the first metal terminal; and a second metal terminal is placed on the other surface of the second substrate. The present invention is applicable to electronic component packaging.</p> |
