PRINTED CIRCUIT BOARD AND PREPARATION METHOD THEREOF

摘要

A printed circuit board and a preparation method thereof. The preparation method includes: making a first through hole in a core board including a metal layer; filling copper into the first through hole; forming a circuit pattern of the metal layer of the core board through an alkaline etching process; successively laminating a dielectric layer and a first copper foil on one side of the core board; making a second through hole opposite to and communicated with the first through hole, in the first copper foil; filling copper into the second through hole; and forming a circuit pattern of the first copper foil. The method for preparing the printed circuit board provided in the present invention can effectively reduce the preparation cost of the printed circuit board, greatly increase the yield of a product and further improve the universality of application.

主权项

1. A method for preparing a printed circuit board, comprising:
making a first through hole in a core board including a metal layer; filling copper into the first through hole; forming a circuit pattern of the metal layer of the core board through an alkaline etching process; successively laminating a dielectric layer and a first copper foil on a side of the core board; making a second through hole opposite to and communicated with the first through hole, in the first copper foil; filling copper into the second through hole; and forming a circuit pattern of the first copper foil.