发明名称 オプトエレクトロニクス半導体チップおよびその製造方法
摘要 An optoelectronic semiconductor chip includes a semiconductor layer stack having an active layer that generates radiation, and a radiation emission side, and a conversion layer disposed on the radiation emission side of the semiconductor layer stack, wherein the conversion layer converts at least a portion of the radiation, which is emitted by the active layer, into radiation of a different wavelength, the radiation emission side of the semiconductor layer stack has a first nanostructuring, and the conversion layer is disposed in this first nanostructuring.
申请公布号 JP5666715(B2) 申请公布日期 2015.02.12
申请号 JP20130538131 申请日期 2011.11.02
申请人 发明人
分类号 H01L33/08;H01L33/20 主分类号 H01L33/08
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