| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat sink that is used for a heat generating semiconductor element to keep its temperature low, and makes a cooling means small in volume and inexpensive, to keep the reliability high. <P>SOLUTION: The heat sink 1 has may heat radiating fins 1B constituted on a base 1A to a thin thickness and a narrow pitch of sub-millimeter order, and is set to 60 mm or shorter, in a direction along a flow of air of a fan, the heat radiating fins is set to 40 mm or shorter. A plurality of heat sinks 1 similar to this may be arranged and thermally connected to one another by a heat transport device 4 to constitute a heat sink assembly. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
