发明名称 PRINTED CIRCUIT BOARD WITH EMBEDDED HEATER
摘要 <p>Aspects of the present invention are directed to providing a printed circuit board including a top conductive layer; a bottom conductive layer; a plurality of electronic components arranged on at least one of the top conductive layer or the bottom conductive layer; a heater layer interposed between the top conductive layer and the bottom conductive layer and configured to generate and transfer heat to at least one of the electronic components.</p>
申请公布号 EP2835030(A1) 申请公布日期 2015.02.11
申请号 EP20130736269 申请日期 2013.01.11
申请人 VIASYSTEMS TECHNOLOGIES CORP., L.L.C. 发明人 WHITE, GIL
分类号 H05B1/00 主分类号 H05B1/00
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