Surface metal wiring structure for an IC substrate

摘要

A surface metal wiring structure for a substrate includes one or more functional μbumps formed of a first metal and an electrical test pad formed of a second metal for receiving an electrical test probe and electrically connected to the one or more functional μbumps. The surface metal wiring structure also includes a plurality of sacrificial μbumps formed of the first metal that are electrically connected to the electrical test pads, where the sacrificial μbumps are positioned closer to the electrical test pad than the one or more functional μbumps.

主权项

1. A surface metal wiring structure for a substrate comprising:
one or more functional μbumps formed of a first metal; an electrical test pad formed of a second metal for receiving an electrical test probe and electrically connected to the one or more functional μbumps, wherein the first and second metals are different; a plurality of sacrificial μbumps formed of the first metal and electrically connected to the electrical test pad, wherein the sacrificial μbumps are positioned closer to the electrical test pad than the one or more functional μbumps, wherein the electrical connection between the plurality of sacrificial μbumps and the test pad provides a pathway for a galvanic process having a lower electrical resistance than the electrical connection between the functional μbumps and the test pad.