| 摘要 |
<p>The present invention relates to a wafer for a WLCSP, an LED module using the same and a method for manufacturing the same. The present invention includes a light transmission sheet which transmits light; an LED chip which has gaps and is bonded onto the light transmission sheet to expose a pad; and a light transmission layer which is stacked on the light transmission sheet to expose the LED chip and transmits light. According to the present invention, a WLCSP (Wafer Level Chip Scale Package) can be used in an LED package. The heat conductivity and heat radiation property of an LED can be improved. The material costs and process costs are reduced. Yield is improved.</p> |
