| 摘要 |
In cases where a recessed and projected pattern is formed in a light extraction surface, which is formed of a semiconductor crystal, by wet etching using an alkaline solution, it has been impossible to form a plurality of projected parts in a desired arrangement. A method for manufacturing a semiconductor light emitting element which is provided with a light extraction surface that is formed of a semiconductor crystal. In this method, in order to form a recessed and projected pattern in a light extraction surface (7) by means of a plurality of projected parts (15), firstly, a plurality of impressions (14) are formed, with use of a processing substrate (11), in the light extraction surface (7) of a semiconductor layer (6) that is formed of a semiconductor crystal, and then, projected parts (15) are formed by wet etching the light extraction surface (7) with use of an alkaline solution, each of said projected parts (15) having the top thereof at the position where an impression (14) is formed, while having a plurality of facet surfaces of the semiconductor crystal as the lateral surfaces thereof. |
