| 发明名称 |
OPTICAL SENSOR APPARATUS |
| 摘要 |
An optical sensor apparatus includes a package having a window; a sensor chip having an array of light receiving devices and a pixel electrode connected to the light receiving device, the sensor chip having an incidence surface that faces the window of the package; and a read-out circuit disposed under the sensor chip, the read-out circuit having a read-out electrode electrically connected to the pixel electrode of the sensor chip. The sensor chip and the read-out circuit are housed in the package. In plan view from the sensor chip, the read-out circuit is overlapped with the sensor chip, and the read-out circuit has no portion extending off the sensor chip. |
| 申请公布号 |
US2015035989(A1) |
申请公布日期 |
2015.02.05 |
| 申请号 |
US201414448311 |
申请日期 |
2014.07.31 |
| 申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
INADA HIROSHI;MIGITA Masaki;IGUCHI Yasuhiro |
| 分类号 |
H04N5/378;H04N5/361;H04N5/33 |
主分类号 |
H04N5/378 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An optical sensor apparatus comprising:
a package having a window; a sensor chip having an array of light receiving devices and a pixel electrode connected to the light receiving device, the sensor chip having an incidence surface that faces the window of the package; and a read-out circuit disposed under the sensor chip, the read-out circuit having a read-out electrode electrically connected to the pixel electrode of the sensor chip, wherein the sensor chip and the read-out circuit are housed in the package, in plan view from the sensor chip, the read-out circuit is overlapped with the sensor chip, and the read-out circuit has no portion extending off the sensor chip. |
| 地址 |
Osaka JP |
