| 摘要 |
PROBLEM TO BE SOLVED: To suppress a dicing blade from meandering in cutting a molded resin with the dicing blade.SOLUTION: In a substrate 10, at least one side surface 10a of the side surfaces between one surface 11 and other surface 12 is a cut surface formed by being cut with a molded resin 40. The molded resin 40 has a surface 40c cut with the substrate 10 and is on the same plane as the cut surface. A part constituting the surface 40c has a surface 40b which is connected to the surface 40c that is on the same plane as the cut surface and which is in parallel to the one surface 11 of the substrate 10, the part having a thickness less than that of a part sealing electronic components 20, 30. Consequently, the molded resin 40 is cut by having a dicing blade 210 in contact with the surface parallel to the one surface 11 of the substrate 10. Therefor, a cutting direction is perpendicular to a surface with which the dicing blade 210 is in contact, so that the dicing blade can be prevented from meandering. |
