| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive adhesive composition having re-adherability after exposure, and improved in pattern formability with an alkali developer, heat resistance after re-adhesion and pasting ability at low temperature when formed into a film shape; an adhesion sheet using the composition; an adhesive pattern; a semiconductor wafer with an adhesive layer; and a semiconductor device; and a method for manufacturing the device. <P>SOLUTION: This photosensitive adhesive composition comprises (A) a polyimide having a carboxy group and/or hydroxy group; (B) a thermosetting resin; (C) a radiation-polymerizable compound; and (D) a photoinitiator, wherein the radiation-polymerizable compound containing a compound having a ≥10.0 (cal/cm<SP>3</SP>)<SP>1/2</SP>solubility parameter contains ≥20 mass% of the whole radiation-polymerizable compound. <P>COPYRIGHT: (C)2010,JPO&INPIT |
