发明名称 フェライト積層電子部品の製造方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a ferrite multilayer electronic component manufacturing method by which a ferrite multilayer electronic component having reduced stress remaining in ferrite around an internal conductor and good characteristics can be manufactured efficiently. <P>SOLUTION: The ferrite multilayer electronic component manufacturing method includes: using a compound containing Fe<SB POS="POST">2</SB>O<SB POS="POST">3</SB>powder, NiO powder and an organic binder to prepare a green sheet; using the green sheet to form an unbaked green sheet laminate including an internal conductor; performing heat treatment on the green sheet laminate under a predetermined condition thereby to defat the green sheet laminate; and baking the defatted laminate. With the Fe<SB POS="POST">2</SB>O<SB POS="POST">3</SB>powder used, the average particle diameter is 0.1 to 0.5μm, and the specific surface area is 10 m<SP POS="POST">2</SP>/g or larger. The defatting is performed under a condition such that the amount of residual carbon in the defatted laminate is 550 to 1000 ppm on a weight basis. The compound used for preparing the green sheet is a compound which has not undergone a calcination process. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5664092(B2) 申请公布日期 2015.02.04
申请号 JP20100223480 申请日期 2010.10.01
申请人 发明人
分类号 H01F41/04;H01F17/00;H01F17/04 主分类号 H01F41/04
代理机构 代理人
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