| 摘要 |
A protector module for use with a communication system, such as a telephone system having a tip line and a ring line, includes a base member and a plurality of electrically conductive pins mounted on the base member. A first electrical contact is fixedly mounted on the top surface of the base member and is in electrical communication with one of the tip line and the ring line. A movable second electrical contact is connected to a ground pin mounted on the base member and is situated in alignment with the first electrical contact. A solder pellet, which may melt in high current, long duration power surges, and a solid state device, are positioned between the first and second electrical contacts. |
| 主权项 |
1. A protector module for use with a communication system, which comprises:
a base member, the base member having a top surface and a bottom surface situated opposite the top surface; a plurality of electrically conductive pins mounted on the base member and extending outwardly from the bottom surface thereof, the plurality of electrically conductive pins including a communication system line pin and a ground pin; a first electrical contact fixedly mounted on the top surface of the base member, the first electrical contact being in electrical communication with one of the communication system line pin and the ground pin; a second electrical contact situated at least partially above and in alignment with the first electrical contact, the second electrical contact being in electrical communication with the other of the communication system line pin and the ground pin, the second electrical contact being movable between a first position in which the second electrical contact is not in electrical communication with the first electrical contact, and a second position in which the second electrical contact is in electrical communication with the first electrical contact; a solid state device, the solid state device being positioned between the first electrical contact and the second electrical contact; and a solder pellet, the solder pellet being positioned between the first electrical contact and the second electrical contact and further being situated in proximity to the solid state device, the solder pellet and the solid state device together being interposed between the first electrical contact and the second electrical contact, the solder pellet being changeable from an unmelted, solid state to a melted, flowable state, the solid pellet, when in the unmelted, solid state, together with the solid state device, biasing the second electrical contact in the first position, where the second electrical contact is not in electrical communication with the first electrical contact, the second electrical contact being in electrical communication with the first electrical contact when the solder pellet is in the melted, flowable state; wherein the base member includes a second electrical contact support extending outwardly from the top surface thereof, the second electrical contact being mounted on the support; wherein each of the first electrical contact and the second electrical contact includes a contact portion, the contact portion of the second electrical contact overlying and being in close proximity to the contact portion of the first electrical contact; and wherein the second electrical contact is generally U-shaped and includes a mounting portion which is fixedly mounted on the second electrical contact support, the contact portion which overlies the contact portion of the first electrical contact, and a resilient intermediate portion situated between the mounting portion and the contact portion of the second electrical contact. |
