Packaged semiconductor devices including pre-molded lead-frame structures, and related methods and systems

摘要

A packaged semiconductor device includes at least first and second lead-fingers. A molded structure forms a cavity and is molded around portions of each of the first and second lead-fingers to thereby mechanically attach each of the first and second lead-fingers to the molded structure. A semiconductor structure (e.g., a IC, chip or die) is attached within the cavity. First and second bond wires respectively providing electrical connections between the semiconductor structure and the first and second lead-fingers. A further portion of each of the first and second lead-fingers is mechanically attached to a bottom surface of the semiconductor structure to inhibit relative mechanical motion between the semiconductor structure, the molded structure and the first and second lead-fingers.

主权项

1. A packaged semiconductor device, comprising:
a pre-molded lead-frame structure including
first and second lead-fingers; anda molded structure that forms a pre-molded cavity and is molded around portions of each of the first and second lead-fingers to thereby mechanically attach each of the first and second lead-fingers to the molded structure;wherein the molded structure includes pre-molded walls and a pre-molded floor that define the pre-molded cavity; andwherein an upper surface of the pre-molded floor is substantially coplanar with a portion of an upper surface of each of the first and second lead-fingers; a semiconductor structure within the pre-molded cavity of the pre-molded lead-frame structure, the semiconductor structure including a top surface and a bottom surface; and first and second bond wires respectively providing electrical connections between the semiconductor structure and the first and second lead-fingers of the pre-molded lead-frame structure; wherein a portion of the upper surface each of the first and second lead-fingers of the pre-molded lead-frame structure is mechanically attached to the bottom surface of the semiconductor structure to inhibit relative mechanical motion between the semiconductor structure, the molded structure and the first and second lead-fingers of the pre-molded lead-frame structure.