| 摘要 |
Provided are a method of manufacturing an electronic component module in which joining portions joining outer terminals of an electronic component and surface electrodes of a substrate are not contacted with a lateral surface of the electronic component, and the electronic component module manufactured by the manufacturing method. Bumps 6, each including a thicker portion having a relatively large thickness and a thinner portion having a relatively small thickness, are formed on one surface of the substrate such that, when looking at the electronic component in a mounted state in a plan view, the thicker portion is positioned on the side closer to a center of the electronic component relative to a corresponding outer terminal 2, and the thinner portion is positioned on the opposite side away from the center of the electronic component relative to the corresponding outer terminal 2. Joining portions 7 joining the outer terminals 2 respectively to the bumps 6, having been formed in the preceding step, through deformation of the bumps are formed such that a height of each joining portion on the opposite side away from the center of the electronic component when looking at the mounted electronic component in a plan view is lower than a height of the joining portion on the side closer to the center of the electronic component. |
