| 发明名称 |
Packaging for semiconductor sensor devices and methods |
| 摘要 |
A pressure sensor includes a first housing having a cavity. The pressure sensor further includes a pressure sensing device attached to a bottom of the cavity. The pressure sensor further includes a layer of gel over the pressure sensing device. The pressure sensor further includes a baffle in contact with the gel to reduce movement of the gel. |
| 申请公布号 |
US8946833(B2) |
申请公布日期 |
2015.02.03 |
| 申请号 |
US201213657250 |
申请日期 |
2012.10.22 |
| 申请人 |
Freescale Semiconductor, Inc. |
发明人 |
Higgins, III Leo M. |
| 分类号 |
H01L29/84 |
主分类号 |
H01L29/84 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A pressure sensor, comprising:
a first housing having a cavity; a pressure sensing device attached to a bottom of the cavity; an electrical connection coupled between the pressure sensing device and another component in the cavity; a layer of gel, the pressure sensing device and at least a portion of the electrical connection being buried in the layer of gel; a lid over the layer of gel; and a baffle in the cavity in contact with the layer of gel to reduce movement of the gel across the electrical connection. |
| 地址 |
Austin TX US |
