| 摘要 |
Disclosed is a method for manufacturing a heat dissipation device for an LED lamp. The method for manufacturing a heat dissipation device for an LED lamp includes a step of manufacturing heat dissipation pins of a plate shape; a step of manufacturing an upper support part which includes a side where grooves capable of inserting the upper end of the heat dissipation pin are formed in radial shape; and a step of welding and inserting the upper end of the heat dissipation pin into the groove of the upper support part to surround the center axis of a heat dissipation device where the heat dissipation pins are arranged in radial shape. |
