| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a technique capable of efficiently jointing a thin film component to a jointing object without breakage using ultrasonic vibration.SOLUTION: Before a thin film capacitor 4 is jointed to a substrate using ultrasonic vibration, each thin film capacitor 41 of a component assembly 4 is transferred to a mold-release sheet 44. Thereby, plural thin capacitors 41 can be easily handled while keeping the mold-release sheet 44, which is efficient. Also, the thin film capacitors 41 are connected to the substrate using ultrasonic vibration, and therefore, there is no risk that a capacitor 42 (metal pads 42a1, 42c1) provided on the thin film capacitors is short-circuited by solder re-molten in a heating cycle such as reflow. Accordingly, the thin film capacitors 41 can be efficiently jointed to the substrate without breakage using ultrasonic vibration.</p> |
