| 摘要 |
<p>PURPOSE: A mold for manufacturing a semiconductor device is provided to prevent void or molding failure in a molding process by flowing encapsulant in a diagonal direction of a cavity. CONSTITUTION: An encapsulant is loaded in a port and flows from the port and a runner. The encapsulant is injected from the runner to a gate(130). A cavity(140) molds the substrate with the encapsulant from a gate. The cavity has four walls(141), four edges(142), and one bottom side(143). The gate is connected to one of four walls of the cavity. An air vent(150) exhausts the air in a molding process. The gate and the air vent are formed in the cavity to face each other in a diagonal direction.</p> |
