| 摘要 |
The semiconductor package (10) has semiconductor structure (80) that is arranged on metal support (90) and is provided with metal surface (50) on top face for electrical contact of semiconductor structure with pin (60) by bonding wires (40). A plastic mass (30) partly encloses the bonding wires and semiconductor structure. An opening (20) is formed in plastic mass at top face of semiconductor structure. An annular embankment (110) is formed on top face of semiconductor structure. A fixing layer (105) is formed between lower surface of embankment and top face of semiconductor structure. An independent claim is included for manufacturing method of semiconductor package. |
