| 摘要 |
<p>PURPOSE: A positive photosensitive resin composition is provided to be able to show an excellent cyclization rate by a low temperature curing reaction, and, therefore, to be able to manufacture a photosensitive resin film with an excellent mechanical property and insulation property. CONSTITUTION: A positive photosensitive resin composition comprises (A) alkali soluble resin selected from a polybenzoxazole precursor, and a polyimide precursor or their combination; (B) a photosensitive diazoquinone compound; (B) a thermoacid generator with a decomposition temperature of 150-200deg.C; and (D) a solvent. The polybenzoxazole precursor includes a repeating unit represented by Chemical formula 1, or both repeating units of Chemical formulas 1 and 2, and has a thermally polymerizable functional group on at least one terminal end.</p> |
