发明名称 SUCTION STRUCTURE, ROBOT HAND, AND ROBOT
摘要 <p>PROBLEM TO BE SOLVED: To unfailingly suction a substrate where warpage occurs.SOLUTION: A suction structure according to one embodiment includes: a fixed base (a plate); a pad; a seal wall; a support part; and a suction hole. The pad includes a contact part which contacts with a suctioned object and is supported by the fixed base. The seal wall is located in the contact part, and the contact part contacts with the suctioned object thereby causing the seal wall to form a vacuum chamber with a main surface part of the pad. The support part is provided at the fixed base and supports the pad at a position offset from the center of the main surface part of the pad. The suction hole is provided at the support part and allows the vacuum chamber to communicate with a vacuum source.</p>
申请公布号 JP2015013356(A) 申请公布日期 2015.01.22
申请号 JP20130142869 申请日期 2013.07.08
申请人 YASKAWA ELECTRIC CORP 发明人 SHIN DAISUKE;KAMIUE MACHIKO;ANDO RYUJI
分类号 B25J15/06;B25J9/06 主分类号 B25J15/06
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