PRINTED CIRCUIT BOARD, ELECTRONIC CIRCUIT AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a folding structure excellent in durability and flexibility, and reduce the number of components to decrease manufacturing cost.SOLUTION: A printed circuit board comprises: a first wiring pattern region 1e provided on a first substrate surface of a flexible insulating substrate 1; a second wiring pattern region 1f arranged on the substrate surface and at a distance from the region 1e; a non-wiring pattern region 1a which is sandwiched between the region 1e and the region 1f and has no wiring pattern; a bypass wiring pattern region 1b arranged on the substrate surface in a direction orthogonal to an arrangement direction of the region 1e, the region 1a and the region 1f; and a cut line 13 which is partially formed to pierce the insulating substrate between the region 1a and the region 1b so as to cross the arrangement direction. The region 1a includes a folding line 14 which is formed to extend in a direction crossing the arrangement direction with one end being terminated by the cut line. The printed circuit board further comprises: a bypass wiring pattern 9 which connects the region 1e and the region 1f and is formed via the region 1b.