| 摘要 |
PROBLEM TO BE SOLVED: To reduce a cost for polishing a surface of a retainer ring.SOLUTION: A manufacturing method of a semiconductor device includes: a step of replacing a retainer ring 20 provided in a head 30 retaining a wafer 22; a step of sticking a polishing sheet 50 to a pad 12 provided on a platen 10; a step of polishing a lower surface of the retainer ring 20 using the polishing sheet 50; a step of removing the polishing sheet 50; and a step of polishing a lower surface of the wafer 22 using the pad 12. |
