| 摘要 |
<p>Provided by the present invention is an inline vacuum reflow device which includes: a magazine loader unit which stacks a printed circuit substrate, which is supplied to an inline, in a magazine; a sealing chamber which fills the inside of the sealing chamber with nitrogen by being supplied with the magazine and performs a soldering in a vacuum state after heating by including a sealing chamber main body of forming a sealed space and having an inlet door and an outlet door, a heater for heating the inside of the sealing chamber main body, a nitrogen supply pipe for supplying nitrogen gas to the inside of the sealing chamber main body, a nitrogen opening/closing valve for opening and closing the nitrogen supply pipe, an air supply pipe for supplying air to the inside of the sealing chamber main body, an air opening/closing valve for opening and closing the air supply pipe, a vacuum pump for making the inside of the sealing chamber main body into a vacuum state, and a pump opening/closing valve of opening and closing a space between the vacuum pump and the sealing chamber main body; and a cooling chamber which receives and cools the magazine passing the sealing chamber by including a cooling chamber main body of forming a sealed space and having an inlet door and an outlet door, a cooling evaporator for cooling the inside of the cooling chamber main body by being connected with the cooler, and a circulation fan for supplying the cool air of the cooling evaporator to the magazine.</p> |
