| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a terminal shape having high connection reliability in a surface mounting type semiconductor package which is surface-mounted on a printed board, in order to solve the problem of the conventional surface mounting type semiconductor in which: depending on the number of lead-out lines for connection to a semiconductor chip inside the semiconductor package connected to a connection terminal 10, an effective connection terminal area 20 is different for every terminal, and the connection reliability is damaged due to difference in the required solder amount. <P>SOLUTION: An effective connection terminal area 20 is uniformized by providing simulated lead-out lines 50. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
