发明名称 SUBSTRATE CONVEYING METHOD AND CONVEYING APPARATUS
摘要 A substrate conveying method includes a step of mounting first and second substrates respectively on vertically separated first and second alignment units by using first and second picks for vertically separating and maintaining the first and second substrates. The substrate conveying method includes a first arrangement step of arranging the first pick at a first receiving position determined based on the alignment position of the first substrate position-adjusted by the first alignment unit and a first receiving step of receiving the first substrate from the first alignment unit by moving the first pick in the vertical direction. The substrate conveying method includes a second arrangement step of arranging the second pick at a second receiving position determined based on the alignment position of the second substrate position-adjusted by the second alignment unit and a second receiving step of receiving the second substrate from the second alignment unit by moving the second pick in the vertical direction.
申请公布号 KR20150007238(A) 申请公布日期 2015.01.20
申请号 KR20140085010 申请日期 2014.07.08
申请人 TOKYO ELECTRON LIMITED 发明人 SHINDO TAKEHIRO
分类号 H01L21/677;B65G49/07 主分类号 H01L21/677
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