| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of further increasing heat dissipation from a semiconductor element while maintaining high adhesion with an insulating sheet.SOLUTION: A semiconductor device comprises an insulating sheet 6, a die pad 2, and a semiconductor chip 3. The insulating sheet 6 has heat dissipation. The die pad 2 is arranged on one principal surface of the insulating sheet 6. The semiconductor chip 3 is arranged on a front-side principal surface 2A which is a principal surface on the side opposite to the insulating sheet 6 of the die pad 2. A dimple 12 is formed in a position in which it does not planarly overlap the semiconductor chip 3 on a rear-side principal surface 2B which is a principal surface on the side on which the semiconductor chip 3 is in contact with the insulating sheet 6 of the die pad 2. |
