| 摘要 |
PROBLEM TO BE SOLVED: To suppress an outflow of a resin that passes through an air vent when the air vent is formed in a substrate, and to prevent a nonfunctional state of the air vent caused by adhesion between a substrate and a mold.SOLUTION: An air vent 16 is formed in a substrate 10 so as to vent air in a cavity of a mold 90 through the air vent 16 while a resin is molded. A solder resist 17 is disposed on the other surface 12 of the substrate 10, opposite to one surface for mounting electronic components, and an opening 17a is formed in the solder resist 17 at a position corresponding to the air vent 16. Thereby, air can be drawn between a lower mold 91 and the solder resist 17 owing to a rugged surface of the solder resist 17, and the resin can be retained in a space 18 formed between the other surface 12 of the substrate 10 and the lower mold 91. This configuration can suppress an outflow of the resin passing through the air vent 16 as well as can prevent a nonfunctional state of the air vent 16 caused by adhesion between the substrate 10 and the mold 90. |
