| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the circuit power factor to improve the facility efficiency in a fluid heating device which heats a fluid pipeline, in which a fluid flows, through energization to heat the fluid.SOLUTION: A linear flow passage R, in which a heated fluid flows, is formed in a flow passage formation body 2, and the flow passage formation body 2 is made of a conductive material. A fluid heating device 100 heats the flow passage formation body 2 through energization to heat the heated fluid. The fluid heating device 100 applies an alternating current to an area between a first power supply member 3 that is connected with one end side 2a of the flow passage of the flow passage formation body 2 and a second power supply member 4 that is connected with the other end side 2b of the flow passage of the flow passage formation body 2. The second power supply member 4 includes a cover body 43 which covers substantially an entire periphery of an outer peripheral surface in an area ranging from the other end side to the one side of the flow passage in the flow passage formation body 2. An end part of the cover body, which is located at the other side of the flow passage, is electrically connected with the flow passage formation body 2.</p> |
