DESIGN AND METHODS TO PACKAGE AND TRANSMIT ENERGY OF HIGH INTENSITY LED DEVICES

摘要

The curing assembly of this invention has one or more fiber optic cables, each transmitting light to a head, which distributes the light onto a substrate in a desired geometric pattern and intensity. Little or none of the heat generated by a light source is transmitted to the vicinity of the substrate. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 C.F.R. §1.72(b).

主权项

1. A curing assembly, comprising:
a lens; a fiber optic cable having a plurality of optic fibers receiving light which has passed through said lens; and a plurality of pinning heads positioning said optic fibers such that light emitted from said optic fibers impinges a substrate in a geometric pattern, said head fixed in a position relative to said substrate, said optic fibers being substantially continuously and linearly positioned within said pinning heads.