WAFER PROCESSING APPARATUS HAVING SCROLL PUMP

摘要

A wafer processing apparatus is disclosed that includes a wafer support and a processing base. The wafer support is configured to support a wafer at a processing position with respect to a processing base. The processing base includes a scroll pump oriented to pump a processing fluid in a substantially perpendicular direction with respect to the surface of the wafer when the wafer contacts the processing fluid while in the processing position. While in contact with the processing fluid, the wafer support may rotate the wafer in the processing fluid. In one embodiment, the diameter of the scroll pump is substantially the same as or greater than the diameter of the surface of the wafer being processed.

主权项

1. A wafer processing apparatus comprising:
a wafer support configured to support a wafer; and a processing base having a scroll pump oriented to pump a processing fluid in a substantially perpendicular direction with respect to the surface of the wafer.