| 发明名称 |
PRINTED CIRCUIT BOARD WITH REDUCED CROSS-TALK |
| 摘要 |
A multi-layer printed circuit board has a number of landing pads that are configured to engage a connector secured thereto. Between the landing pads associated with different signals is at least one micro via that is electrically connected to a ground plane on an outer surface of the multi-layer printed circuit board, and a ground plane on an inner layer of the multi-layer printed circuit board. |
| 申请公布号 |
US2015013155(A1) |
申请公布日期 |
2015.01.15 |
| 申请号 |
US201414507201 |
申请日期 |
2014.10.06 |
| 申请人 |
Cray Inc. |
发明人 |
Kim Hyunjun;Conger Jeffrey Scott;Scott Gregory Erwin |
| 分类号 |
H05K1/02;H05K1/11 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a multi-layer printed circuit board comprising:
forming a number of landing pads on an outer layer of the printed circuit board that are electrically connectable to a socket connector; forming a portion of a ground plane between landing pads that are associated with different signals to be coupled to the connector; and forming one or more micro vias between the landing pads that are associated with different signals, wherein the micro vias are electrically connected to a ground plane on the outer layer of the circuit board and to a ground plane on an inner layer of the circuit board. |
| 地址 |
Seattle WA US |
