发明名称 WAFER PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a wafer processing device which can flexibly respond to a user request. ! SOLUTION: A wafer processing device for performing processing on a wafer comprises: a cassette placement unit for placing a cassette which stores a plurality of wafers; a carry-out unit for carrying out the wafer from the cassette placed on the cassette placement unit; a transfer unit for transferring the wafer carried out by the carry-out unit; a plurality of processing units arranged adjacent to the transfer unit, for performing different types of processing on the wafer, respectively; and a control unit for controlling each unit. Each of the plurality of processing units includes a chuck table for holding the wafer transferred by the transfer unit and processing means for performing processing on the wafer held by the chuck table, and the plurality of processing units are arranged adjacent to each other. ! COPYRIGHT: (C)2015,JPO&INPIT
申请公布号 JP2015008195(A) 申请公布日期 2015.01.15
申请号 JP20130132459 申请日期 2013.06.25
申请人 DISCO ABRASIVE SYST LTD 发明人 MIZOMOTO YASUTAKA ; KIZAKI SEIKI ; RIKIISHI TOSHIYASU
分类号 H01L21/304;H01L21/677 主分类号 H01L21/304
代理机构 代理人
主权项
地址