| 摘要 |
<p>Disclosed is a wire bonding apparatus. According to an embodiment of the present invention, the wire bonding apparatus is capable of easily performing a wetting experiment of a material by size, reducing the required time and human resources through re-examination prevention, accurately measuring and ensuring reproducibility by quickly and accurately bonding and correcting a wire in a wire fixing position of a material processed equally or by size in a wetting test process. Moreover, the wire bonding apparatus comprises: a main body having a supporting stand; a material arranging part supplied to the supporting stand to arrange a material with which a wire is combined; a wire supplying part to supply the wire combined with the material; and a bonding part to weld and bond the wire supplied from the wire providing part to the material.</p> |
