SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

A fan-out package includes a molding compound, a conductive plug, and a stress buffering unit. The conductive plug is located in the molding compound. The stress buffering unit is located between the conductive plug and the molding compound. A stress buffering layer has a coefficient of thermal expansion (CTE). The CTE of the stress buffer layer is located between the CTE of the molding compound and the CTE of the conductive plug. A method for manufacturing a 3D semiconductor structure includes the steps of: plating the substrate with a post; and arranging the stress buffering unit on the sidewall of the post. The present invention further includes the steps of surrounding the stress buffering unit with the molding compound.