| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit device configured by erecting slave substrates on a master substrate and capable of improving strength against vibration while suppressing an increase in manufacturing processes. ! SOLUTION: In an electronic circuit device including a master substrate 20 on which inserted mounting articles 24 are mounted and slave substrates 30 each of which is erected on the master substrate 20 by fixing a lower side 30a of an outer edge part on the master substrate 20 and on which control elements 31 are surface-mounted by solder and allowed to be used in a vibration environment, the slave substrate 30 is provided with a reinforcement member 33 surface-mounted by solder along at least one side excluding the lower side 30 of the slave substrate 30. ! COPYRIGHT: (C)2015,JPO&INPIT |
