发明名称 |
SELF-POWERED PIEZOELECTRIC ENERGY HARVESTING MICROSYSTEM |
摘要 |
A self-powered piezoelectric energy harvesting microsystem device has CMOS integrated circuit elements, contacts and interconnections formed at a proof mass portion of a die region of a semiconductor wafer. Piezoelectric energy harvesting unit components connected to the integrated circuit elements are formed at a thinned beam portion of the die region that connects the proof mass portion for vibration relative to a surrounding anchor frame portion. A battery provided on the proof mass portion connects to the integrated circuit elements. In a cantilever architectural example, the battery is advantageously located at a distal end of the proof mass portion, opposite the joinder with frame portion via the beam portion. |
申请公布号 |
US2015008792(A1) |
申请公布日期 |
2015.01.08 |
申请号 |
US201414325182 |
申请日期 |
2014.07.07 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
Gong Cuiling;Wang Jianbai Jenn |
分类号 |
H02N2/18;H02N2/00 |
主分类号 |
H02N2/18 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method of forming a self-powered piezoelectric energy harvesting microsystem, comprising:
forming integrated circuit elements including transistor gate structures and source/drain regions using CMOS processing steps at a proof mass first portion of a die region of a semiconductor wafer substrate; depositing and patterning dielectric layers and metal layers at the first portion of the die region to form contacts and interconnections for the integrated circuit elements; depositing and patterning first electrode, piezoelectric material and second electrode layers at a beam second portion of the die region to form piezoelectric energy harvesting unit components connected to the integrated circuit elements; etching fully through the substrate to form a support frame third portion of the die region separated by a gap from a majority of the first portion and joining by the second portion to a minority of the first portion; etching partially through the substrate to thin the second portion; and providing a battery connected to the integrated circuit elements at the first portion of the die region. |
地址 |
Dallas TX US |