| 摘要 |
The purpose of the present invention is to provide a method for manufacturing a printed wiring board having excellent reliability in terms of insulation between wiring. The method for manufacturing a printed wiring board comprises: a layer forming step in which a substrate and a core substrate that is provided on the substrate and contains copper or copper alloy wiring are brought into contact with a treatment liquid which contains 1,2,3-triazole and/or 1,2,4-triazole and exhibits pH 5 to 12, the core substrate is washed with solvent, and a copper ion diffusion suppression layer which contains 1,2,3-triazole and/or 1,2,4-triazole is formed on the surface of the copper or copper alloy wiring; and an insulating layer forming step in which, after the layer forming step, an insulating layer is formed on the core substrate on which the copper ion diffusion suppression layer has been provided. |
