APPARATUS FOR TEMPORARY BONDING OF SUBSTRATE ON A CARRIER AND METHOD THEREOF

摘要

Disclosed are an apparatus and a method for temporary bonding and delamination of a substrate on a support. According to an embodiment of the present invention, the apparatus for temporary bonding and delamination of the substrate on the support includes an electric conductivity adhesive layer located between the support and the substrate and a current supply source for applying a current to the electric conductive adhesive layer. The method for temporary bonding and delamination of the substrate on the support includes the steps of: forming the electric conductivity adhesive layer on a support surface; laminating the substrate on the electric conductivity adhesive layer; applying the current to the electric conductivity adhesive layer and heating the electric conductivity adhesive layer; and delaminating the substrate from the support surface by breaking the electric conductivity adhesive layer.