发明名称 PROTECTIVE FILM FORMING METHOD, AND SURFACE FLATTENING METHOD
摘要 <p>A method for flattening a surface of a substrate in which a film formation surface has a recess and a convex and a method for forming a protective film by using a photo-curable organic thin film material are provided. A gas of an organic thin film material having photocurability is liquefied on the surface of a substrate having the recess and the convex and a liquid organic layer is grown on the surface of the substrate (first liquid layer growing step T1); and the growth is terminated when a liquid organic layer having a flat surface is formed (first growth termination step T2).</p>
申请公布号 KR101479528(B1) 申请公布日期 2015.01.07
申请号 KR20137008401 申请日期 2011.08.30
申请人 发明人
分类号 B05D3/06;B05D7/00;H05B33/02;H05B33/10 主分类号 B05D3/06
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