| 发明名称 | Flip chip pad geometry for an IC package substrate | ||
| 摘要 | An integrated circuit (IC) package substrate is provided. In one embodiment, the IC package substrate includes a dielectric layer having first and second opposing surfaces and a matrix of pillars disposed in the dielectric layer and arranged to receive a matrix of conductive elements of an IC die. Each pillar of the matrix of pillars is exposed at the first surface of the dielectric layer. Each pillar of the matrix of pillars extends through the dielectric layer to contact a metal layer attached to the second surface of the dielectric layer. | ||
| 申请公布号 | US9373576(B2) | 申请公布日期 | 2016.06.21 |
| 申请号 | US201414151506 | 申请日期 | 2014.01.09 |
| 申请人 | Broadcom Corporation | 发明人 | Tsang Kwok Cheung |
| 分类号 | H01L29/40;H01L23/498;H01L21/48;H05K3/40;H05K3/02 | 主分类号 | H01L29/40 |
| 代理机构 | Sterne, Kessler, Goldstein & Fox P.L.L.C. | 代理人 | Sterne, Kessler, Goldstein & Fox P.L.L.C. |
| 主权项 | 1. An integrated circuit (IC) package substrate, comprising: a dielectric layer having first and second opposing surfaces; and a matrix of pillars disposed in the dielectric layer and arranged to receive a matrix of conductive elements of an IC die, wherein each pillar of the matrix of pillars is exposed at the first surface of the dielectric layer and wherein each pillar of the matrix of pillars extends through the dielectric layer to contact a metal layer attached to the second surface of the dielectric layer, and wherein an exposed surface of each pillar of the matrix of pillars is larger in a first direction than in a second direction. | ||
| 地址 | Irvine CA US | ||