发明名称 Lithographic apparatus having a chuck with a visco-elastic damping layer
摘要 A lithographic apparatus includes an illumination system configured to condition a radiation beam, a support constructed to support a patterning device, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam, a substrate table constructed to hold a substrate, a projection system configured to project the patterned radiation beam onto a target portion of the substrate, a chuck configured to hold and position an object, for example, the patterning device onto the support or the substrate onto the substrate table, the chuck including a base and a constraining layer. A damping layer including a viscoelastic material is provided between the base and the constraining layer.
申请公布号 US8928860(B2) 申请公布日期 2015.01.06
申请号 US200912370741 申请日期 2009.02.13
申请人 ASML Netherlands B.V. 发明人 Hempenius Peter Paul;Bijvoet Dirk-Jan;De Vos Youssef Karel Maria;Kamidi Ramidin Izair
分类号 G03B27/58;G03B27/68;G03F7/20 主分类号 G03B27/58
代理机构 Pillsbury Winthrop Shaw Pittman LLP 代理人 Pillsbury Winthrop Shaw Pittman LLP
主权项 1. A lithographic apparatus comprising: a patterning device support constructed to support a patterning device, the patterning device being capable of imparting a radiation beam with a pattern in a cross-section of the radiation beam to form a patterned radiation beam; a substrate table constructed to hold a substrate; a projection system configured to project the patterned radiation beam onto a target portion of the substrate; a chuck configured to hold and position an object, the chuck comprising a base and a constraining layer, and a damping layer comprising a viscoelastic material and provided between the base and the constraining layer, wherein at least one of the damping layer and constraining layer is segmented in a plane thereof to form at least two detached segments in said at least one of the damping layer and the constraining layer, wherein an elasticity modulus of the constraining layer is at least 10 times greater than an elasticity modulus of the damping layer, and wherein a thickness of the damping layer is between about 100 μm and 1000 μm.
地址 Veldhoven NL