Light emitting device package comprising a lead electrode exposed to a recessed bottom portion of the package body

摘要

A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.

主权项

1. A semiconductor light emitting device package, comprising:
metal layers having at least two lead electrodes, the metal layers disposed to be spaced apart from each other; a semiconductor light emitting device on at least one of the at least two lead electrodes; a package body having an upper surface, a lower surface, and a cavity between the upper surface and the lower surface; and a molding layer disposed on the semiconductor light emitting device, wherein at least two of the metal layers are extended to outside of the package body, wherein a bottom surface of the at least one of the at least two lead electrodes is exposed to a bottom surface of the package body, wherein the lower surface of the package body comprises a recessed bottom portion, wherein the recessed bottom portion comprises a first surface and a second surface substantially vertical to the first surface, and wherein the second surface is substantially flush with at least one end portion of the at least two lead electrodes.