发明名称 A METHOD OF MOULDING
摘要 <p>A method includes patterning one or more electrical layers on a substrate; shaping the patterned substrate into a 3-dimensional contour, wherein the contour including a significant change in gradient in or adjacent to one or more sensing areas of the electrical layer, and over-molding the shaped substrate. Degradation of a trace in the electrical layer at or adjacent to the one or more sensing areas during shaping and/or over-molding is substantially minimized based on the width of the trace, the thickness or number of layers of the trace, the bending radius of the trace, the material of the trace, and/or a primer over layer on the trace.</p>
申请公布号 KR101479892(B1) 申请公布日期 2015.01.06
申请号 KR20137018360 申请日期 2012.10.09
申请人 发明人
分类号 B29C45/14;B32B37/18;H03K17/96 主分类号 B29C45/14
代理机构 代理人
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