Sealing agent with low softening temperature useful in the preparation of electronic devices

摘要

The invention includes a composition for sealing agent, generally in the form of glass frit, lead-free, comprising by weight over the total weight of the composition: 30-80% Bi2O3; 2-10% ZnO; 2-10% B2O3; 0-5% Na2O; 1-10% SiO2; 1-8% Al2O3; 0-7% BaO; and 0-8% MgO. The composition for sealing agent as defined above can be added with a filler in a quantity up to 20% by weight over the total weight of the resulting mixture. The invention also includes a sealing paste containing the composition for sealing agent, the optional filler, an organic binder and optionally an organic solvent. The invention also includes methods for producing and using the composition for sealing agent and the sealing paste, as well as an electronic device sealed with the sealing paste.

主权项

1. A lead-free composition, comprising about: 60% Bi2O3, 5% ZnO, 7% B2O3, 10% SiO2, 7% Al2O3, 6% BaO, 1% MgO, 2% Na2O, 1% Y2O3, and 1% Nd2O3, based on the total weight of the composition.