发明名称 WORKING METHOD OF SAPPHIRE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a working method of a sapphire substrate which hardly produces waste in cutting-out from a sapphire ingot and can secure surface precision of the sapphire substrate having an A face fitting well onto a luminescent layer as front and back surfaces.SOLUTION: A working method of a sapphire substrate for performing grinding working of a sapphire substrate which is cut out from an ingot of sapphire and has the front surface and back surface formed of an A face includes: a holding process for holding one side surface of the sapphire substrate to a chuck table which holds a work-piece and can be rotated; and a grinding process for grinding the other side surface of the sapphire substrate by bringing grinding stones into contact with the other side surface of the sapphire substrate while rotating the chuck table which holds the sapphire substrate and, at the same time, rotating a grinding wheel on which the grinding stones are annularly arranged. In the grinding process, slurry into which diamond abrasive grains are mixed is supplied as grinding liquid to a grinding part by the grinding stone.
申请公布号 JP2015000441(A) 申请公布日期 2015.01.05
申请号 JP20130125151 申请日期 2013.06.14
申请人 DISCO ABRASIVE SYST LTD 发明人 ADACHI TAKUYA
分类号 B24B7/22;B24B7/04;B24B55/02 主分类号 B24B7/22
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